UV Light Source.

Beam Size : 4.25′ X 4.25′(4M), 6.25′ X 6.25′(6M)

Lamp power : 200, 350, 500, 1000Watt.

Beam Uniformity : Less than ±3~5%

UV Power Supply.

Power Regulation : Better than ±0.5%

Intensity Control : Optical Feedback loop

                          with ±2% long term repeatability.

Mask Alignment Tooling System.

Mask Size Capability: Max 5′X 5′(4M), 7′X 7′(6M).

Mask Clamp: Vacuum and Physical Clamp.

Mask/Substrate Separation: Manual, User settable

   Micrometer in 2.5micron increments.

Chuck Motions: X,Y, Theta and Z motion control via Micrometer.

Chuck X-Y Range: +/- 10mm.

Chuck Theta Rotation: +/-4 degrees.

Chuck Z motion Range: 5mm

Chuck Leveling: Wedge Error Compensation System.

Substrate Capability: ~ 4inch wafer, 4′X 4′ substrate.(4M),

                                ~ 6inch wafer, 6′X 6′ substrate.(6M)

Printing Capability: Manual Proximity, Soft Contact and

   Adjustable Vacuum Contact.

Printing Resolution: 0.8 micron in Vacuum Contact.

Vision System.

Magnification: 90~400X.

Dual Zoom Microscope.

Monitor and CCD: 9inch B/W Monitors(2), Dual CCD Camera.

Illumination: Optical Fiber illumination.

System Control.

Control Functions :Manual Operation, Power On/Off,

  Expose, Substrate Vacuum, Mask Vacuum, Contact

Timer: 0.1 to 999.9sec in 0.1 sec increments.

Gauge: System Vacuum, Contact Vacuum and Nitrogen,

   System Air.

Special Mask Moving Option(특허출원)

 조각 시료로 소자 제작시 여러 Step의 Mask pattern을 한장의

    Mask에 제작한 후 Mask를 공정 step에 따라 이동 시켜 노광

    시킬 수 있는 시스템으로 소자 개발 시 마스크 가격을 획기적

    으로 절감할 수 있는 유용한 장비입니다.

Facilities

Electrical: Single phase, 220VAC, 15A

CDA: 5kgf/㎠, 6Φ one touch fitting

Nitrogen: 3kgf/㎠, 6Φ one touch fitting

Exhaust: Dia.100

Vacuum: 650mmHg.